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Titanium Trisulfide Monolayer: Theoretical Prediction of a New Direct-Gap Semiconductor with High and Anisotropic Carrier Mobility

机译:三硫化钛单层膜:具有高各向异性载流子迁移率的新型直接间隙半导体的理论预测

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摘要

A new two-dimensional (2D) layered material, namely, titanium trisulfide (TiS3) monolayer, is predicted to possess novel electronic properties. Ab initio calculations show that the perfect TiS3 monolayer is a direct-gap semiconductor with a bandgap of 1.02 eV, close to that of bulk silicon, and with high carrier mobility. More remarkably, the in-plane electron mobility of the 2D TiS3 is highly anisotropic, amounting to about 10,000 cm2 V−1 s−1 in the b direction, which is higher than that of the MoS2 monolayer, whereas the hole mobility is about two orders of magnitude lower. Furthermore, TiS3 possesses lower cleavage energy than graphite, suggesting easy exfoliation for TiS3. Both dynamical and thermal stability of the TiS3 monolayer is examined by phonon-spectrum calculation and Born–Oppenheimer molecular dynamics simulation. The desired electronic properties render the TiS3 monolayer a promising 2D atomic-layer material for applications in future nanoelectronics.Includes Supplemental Materials (Fig. S1)
机译:新型的二维(2D)层状材料,即三硫化钛(TiS3)单层,预计将具有新颖的电子性能。从头算计算表明,理想的TiS3单层是带隙为1.02?eV的直接间隙半导体,接近于体硅的带隙,并且具有高载流子迁移率。更值得注意的是,二维TiS3的面内电子迁移率高度各向异性,在b方向上约为10,000 cm2 V-1 s-1,比MoS2单层的高,而空穴迁移率约为2降低几个数量级。此外,TiS3的裂解能比石墨低,表明TiS3容易剥落。通过声子谱计算和Born–Oppenheimer分子动力学模拟检查了TiS3单层的动力学和热稳定性。所需的电子特性使TiS3单层成为有希望的二维原子层材料,可用于未来的纳米电子学中。包括补充材料(图S1)

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    Dai, Jun; Zeng, Xiao Cheng;

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  • 年度 2015
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